268-5401-11-1102JH
| Parameters | |
|---|---|
| Contact Material | Copper |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Package / Case | LCC |
| Number of Pins | 68 |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Weight | 453.59237g |
| Number of Positions or Pins (Grid) | 68 (4 x 17) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Operating Temperature | -55°C~105°C |
| Packaging | Bulk |
| Published | 2001 |
| Series | OEM |
| Feature | Closed Frame |
| Part Status | Discontinued |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Type | CLCC |
| Contact Finish - Mating | Gold |
| Current Rating (Amps) | 1A |
| Pitch - Mating | 0.100 2.54mm |
| Number of Contacts | 64 |
| Termination Post Length | 0.100 2.54mm |
| Pitch - Post | 0.100 2.54mm |
| Height | 8.7mm |
| Length | 30.7mm |
| Width | 30.7mm |
| Contact Finish Thickness - Mating | 30.0μin 0.76μm |
| Contact Finish Thickness - Post | 30.0μin 0.76μm |
| Material Flammability Rating | UL94 V-0 |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
See Relate Datesheet
