Parameters | |
---|---|
Mounting Type | Through Hole |
Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
Number of Positions or Pins (Grid) | 28 (2 x 14) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Brass |
Operating Temperature | -55°C~105°C |
Packaging | Bulk |
Published | 2006 |
Series | Lo-PRO®file, 513 |
JESD-609 Code | e3 |
Feature | Closed Frame |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
ECCN Code | EAR99 |
Type | DIP, 0.3 (7.62mm) Row Spacing |
Number of Positions | 28 |
Number of Rows | 2 |
Additional Feature | LOW PROFILE; UL 94V-0 |
Contact Finish - Mating | Gold |
Current Rating | 3A |
Pitch - Mating | 0.100 2.54mm |
Lead Pitch | 2.54mm |
Number of Contacts | 28 |
Contact Finish - Post | Tin |
PCB Contact Pattern | RECTANGULAR |
Body Breadth | 0.4 inch |
Lead Length | 3.175mm |
Body Depth | 0.165 inch |
Contact Style | RND PIN-SKT |
Mating Contact Pitch | 0.1 inch |
PCB Contact Row Spacing | 0.3 mm |
Termination Post Length | 0.125 3.18mm |
Pitch - Post | 0.100 2.54mm |
Contact Finish Thickness - Mating | 10.0μin 0.25μm |
Contact Finish Thickness - Post | 200.0μin 5.08μm |
Material Flammability Rating | UL94 V-0 |
RoHS Status | ROHS3 Compliant |
Flammability Rating | UL94 V-0 |
Factory Lead Time | 1 Week |
Mount | Through Hole |