Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Through Hole |
Mounting Type | Through Hole |
Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
Number of Positions or Pins (Grid) | 28 (2 x 14) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Beryllium Copper |
Packaging | Bulk |
Published | 2005 |
Series | 57 |
JESD-609 Code | e3 |
Feature | Closed Frame |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
ECCN Code | EAR99 |
Type | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing |
Number of Positions | 28 |
Additional Feature | STANDARD: UL 94V-0 |
Contact Finish - Mating | Tin |
Current Rating | 1A |
Pitch - Mating | 0.100 2.54mm |
Number of Contacts | 28 |
Lead Length | 2.794mm |
Termination Post Length | 0.110 2.78mm |
Pitch - Post | 0.100 2.54mm |
Contact Finish Thickness - Mating | 200.0μin 5.08μm |
Contact Finish Thickness - Post | 200.0μin 5.08μm |
Material Flammability Rating | UL94 V-0 |
RoHS Status | ROHS3 Compliant |
Flammability Rating | UL94 V-0 |