Parameters | |
---|---|
Contact Material | Copper |
Mount | Through Hole |
Mounting Type | Through Hole |
Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
Number of Positions or Pins (Grid) | 28 (2 x 14) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Beryllium Copper |
Packaging | Bulk |
Published | 2007 |
Series | 516 |
JESD-609 Code | e3 |
Feature | Closed Frame |
Pbfree Code | yes |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | Not Applicable |
Termination | Solder |
ECCN Code | EAR99 |
Type | DIP, ZIF (ZIP) |
Number of Positions | 28 |
Number of Rows | 2 |
Additional Feature | UL STANDARD: 94V-0 |
Contact Finish - Mating | Tin |
Current Rating (Amps) | 1A |
Pitch - Mating | 0.100 2.54mm |
Lead Pitch | 2.54mm |
Number of Contacts | 28 |
Termination Post Length | 0.150 3.81mm |
Pitch - Post | 0.100 2.54mm |
Height | 11.1mm |
Length | 41.1mm |
Width | 19.8mm |
Contact Finish Thickness - Mating | 10.0μin 0.25μm |
Contact Finish Thickness - Post | 10.0μin 0.25μm |
Material Flammability Rating | UL94 V-0 |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |