28-650000-10
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Brass |
| Contact Plating | Tin |
| Package / Case | DIP |
| Material | FR4 Epoxy Glass |
| Package Accepted | SOIC |
| Published | 2010 |
| Series | Correct-A-Chip® 650000 |
| Size / Dimension | 2.800Lx0.480W 71.12mmx12.19mm |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Number of Positions | 28 |
| Max Operating Temperature | 105°C |
| Min Operating Temperature | -55°C |
| Number of Rows | 2 |
| Additional Feature | SOCKET ADAPTER |
| Pitch | 0.050 1.27mm |
| Number of Contacts | 28 |
| Row Spacing | 15.24 mm |
| Device Socket Type | IC SOCKET |
| Proto Board Type | SMD to DIP |
| Height | 1.58mm |
| Board Thickness | 0.062 1.57mm 1/16 |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
See Relate Datesheet
