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299-93-318-11-001000

CONN IC DIP SOCKET 18POS GOLD


  • Manufacturer: Mill-Max Manufacturing Corp.
  • Nocochips NO: 520-299-93-318-11-001000
  • Package: -
  • Datasheet: -
  • Stock: 958
  • Description: CONN IC DIP SOCKET 18POS GOLD (Kg)

Details

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Parameters
Mounting Type Through Hole, Right Angle, Horizontal
Number of Pins 18
Insulation Material Polychlorinated
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Number of Positions or Pins (Grid) 18 (2 x 9)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass Alloy
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2011
Series 299
JESD-609 Code e0
Feature Closed Frame
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.3 (7.62mm) Row Spacing
Number of Rows 2
Additional Feature DIP SOCKET
HTS Code 8536.90.40.00
Voltage - Rated DC 150V
Contact Finish - Mating Gold
Orientation Right Angle
Depth 8.13mm
Current Rating 3A
Pitch - Mating 0.100 2.54mm
Voltage - Rated AC 100V
Lead Pitch 2.54mm
Number of Contacts 18
Contact Finish - Post Tin-Lead
Contact Resistance 10mOhm
Insulation Resistance 10GOhm
Row Spacing 7.62 mm
Termination Post Length 0.126 3.20mm
Pitch - Post 0.100 2.54mm
Length 22.8mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 200.0μin 5.08μm
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
Factory Lead Time 1 Week
Mount Horizontal, Through Hole
See Relate Datesheet

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