Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
Contact Plating | Lead, Tin |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | TO-213AA, TO-66-2 |
Transistor Element Material | SILICON |
Operating Temperature | -65°C~200°C TJ |
Packaging | Bulk |
Published | 2007 |
JESD-609 Code | e0 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Terminal Finish | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier |
HTS Code | 8541.29.00.95 |
Max Power Dissipation | 90W |
Terminal Position | BOTTOM |
Terminal Form | PIN/PEG |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Reach Compliance Code | not_compliant |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | O-MBFM-P2 |
Qualification Status | Not Qualified |
Power - Max | 90W |
Polarity/Channel Type | PNP |
Transistor Type | PNP |
Collector Emitter Voltage (VCEO) | 2V |
Max Collector Current | 7A |
DC Current Gain (hFE) (Min) @ Ic, Vce | 25 @ 2.5A 4V |
Current - Collector Cutoff (Max) | 500μA |
Vce Saturation (Max) @ Ib, Ic | 2V @ 1.75A, 7A |
Collector Emitter Breakdown Voltage | 60V |
RoHS Status | Non-RoHS Compliant |