Parameters | |
---|---|
Contact Plating | Tin |
Mounting Type | Through Hole |
Package / Case | SC-94 |
Surface Mount | NO |
Number of Pins | 3 |
Transistor Element Material | SILICON |
Operating Temperature | 150°C TJ |
Packaging | Tube |
Published | 2013 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Not For New Designs |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Additional Feature | HIGH RELIABILITY |
Technology | MOSFET (Metal Oxide) |
Pin Count | 3 |
Number of Elements | 1 |
Power Dissipation-Max | 3W Ta 50W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 3W |
Case Connection | ISOLATED |
Turn On Delay Time | 12 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 13 Ω @ 1A, 10V |
Input Capacitance (Ciss) (Max) @ Vds | 380pF @ 30V |
Current - Continuous Drain (Id) @ 25°C | 2A Ta |
Gate Charge (Qg) (Max) @ Vgs | 37.5nC @ 10V |
Rise Time | 37ns |
Drain to Source Voltage (Vdss) | 1500V |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±35V |
Fall Time (Typ) | 59 ns |
Turn-Off Delay Time | 152 ns |
Continuous Drain Current (ID) | 2A |
Gate to Source Voltage (Vgs) | 20V |
Drain Current-Max (Abs) (ID) | 2A |
Drain to Source Breakdown Voltage | 1.5kV |
Pulsed Drain Current-Max (IDM) | 4A |
Height | 24.5mm |
Length | 15.5mm |
Width | 5.5mm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 1 day ago) |