Parameters | |
---|---|
Contact Material | Beryllium Copper |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | SIP |
Contact Shape | Circular |
Insulation Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Housing Material | PLASTIC |
Body Material | PBT, Polybutylene, Polyester |
Operating Temperature | -55°C~125°C |
Packaging | Bulk |
Published | 2009 |
Series | 316 |
JESD-609 Code | e0 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
ECCN Code | EAR99 |
Connector Type | Elevated Socket |
Number of Positions | 20 |
Number of Rows | 1 |
Additional Feature | SIP |
Fastening Type | Push-Pull |
Contact Finish - Mating | Gold |
Contact Type | Female Socket |
Orientation | Straight |
Insulation Height | 0.315 8.00mm |
Style | Board to Board |
Number of Positions Loaded | All |
Current Rating | 3A |
Pitch - Mating | 0.100 2.54mm |
Insulation Color | Black |
Voltage - Rated AC | 667mV |
Contact Length - Post | 0.118 3.00mm |
Number of Contacts | 3 |
Contact Finish - Post | Tin-Lead |
Device Socket Type | IC SOCKET |
Height | 8mm |
Width | 2.54mm |
Contact Finish Thickness - Mating | 30.0μin 0.76μm |
Contact Finish Thickness - Post | 200.0μin 5.08μm |
Material Flammability Rating | UL94 V-0 |
RoHS Status | ROHS3 Compliant |
Flammability Rating | UL94 V-0 |