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32-6552-18

CONN IC DIP SOCKET ZIF 32POS


  • Manufacturer: Aries Electronics
  • Nocochips NO: 90-32-6552-18
  • Package: -
  • Datasheet: -
  • Stock: 147
  • Description: CONN IC DIP SOCKET ZIF 32POS (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mounting Type Through Hole
Housing Material Polyetheretherketone (PEEK), Glass Filled
Number of Positions or Pins (Grid) 32 (2 x 16)
Contact Material - Mating Beryllium Nickel
Contact Material - Post Beryllium Nickel
Operating Temperature -55°C~250°C
Packaging Bulk
Series 55
Feature Closed Frame
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing
Additional Feature STANDARD: UL 94V-0
Contact Finish - Mating Nickel Boron
Current Rating (Amps) 1A
Terminal Pitch 2.54mm
Pitch - Mating 0.100 2.54mm
Body Length or Diameter 2.19 inch
Number of Contacts 32
Contact Finish - Post Nickel Boron
PCB Contact Pattern RECTANGULAR
Body Breadth 0.9 inch
Body Depth 0.47 inch
Contact Style SQ PIN-SKT
Insulation Resistance 1000000000Ohm
Mating Contact Pitch 0.1 inch
Dielectric Withstanding Voltage 1000VAC V
Termination Post Length 0.110 2.78mm
Pitch - Post 0.100 2.54mm
Contact Finish Thickness - Mating 50.0μin 1.27μm
Contact Finish Thickness - Post 50.0μin 1.27μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
See Relate Datesheet

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