Parameters | |
---|---|
Factory Lead Time | 1 Week |
Package / Case | SMD/SMT |
Material | Beryllium Copper |
Operating Temperature | -40°C~100°C |
Packaging | Tape & Reel (TR) |
Series | WE-SECF |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Type | Shield Finger |
Plating | Gold |
Attachment Method | Solder |
Storage/Refrigeration Temperature | -4°F~212°F - 40°C~100°C |
Height | 0.157 4.00mm |
Length | 0.138 3.50mm |
Width | 0.098 2.50mm |
Plating Thickness | Flash |
Thickness | 4mm |
REACH SVHC | Unknown |
RoHS Status | ROHS3 Compliant |