Parameters | |
---|---|
Contact Material | BERYLLIUM COPPER |
Housing Material | GLASS FILLED POLYSULFONE |
Series | Scotch® 300 |
JESD-609 Code | e4 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | Not Applicable |
ECCN Code | EAR99 |
Additional Feature | STANDARD: UL 94V-0 |
HTS Code | 8536.69.40.40 |
Contact Finish - Mating | GOLD (30) OVER NICKEL (50) |
Number of Contacts | 14 |
Contact Finish Termination | Gold (Au) - with Nickel (Ni) barrier |
Shelf Life | 18 Months |
Storage/Refrigeration Temperature | 40°F~80°F 4°C~26°C |
Shelf Life Start | Date of Manufacture |
Device Socket Type | IC SOCKET |
Device Type Used On | DIP14 |
RoHS Status | RoHS Compliant |