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335824B00034G

Heat Sink Passive Pin Array Adhesive Black Anodized


  • Manufacturer: Aavid, Thermal Division of Boyd Corporation
  • Nocochips NO: 4-335824B00034G
  • Package: BGA
  • Datasheet: PDF
  • Stock: 250
  • Description: Heat Sink Passive Pin Array Adhesive Black Anodized (Kg)

Details

Tags

Parameters
Thermal Resistance @ Forced Air Flow 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural 29.40°C/W
Power Dissipation @ Temperature Rise 2.0W @ 60°C
Diameter 19.05mm
Height 9mm
Length 1.180 29.97mm
Width 1.180 29.97mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
Factory Lead Time 1 Week
Package / Case BGA
Material Aluminum
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
Published 2002
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Top Mount
Color Black
Depth 30mm
Attachment Method Thermal Tape, Adhesive (Included)
Height Off Base (Height of Fin) 0.370 9.40mm
See Relate Datesheet

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