banner_page

3413.0329.11

Fuse Chip Slow Blow Acting 12A 32V SMD Solder Pad 1206 Epoxy Glass Blister T/R


  • Manufacturer: Schurter Inc.
  • Nocochips NO: 685-3413.0329.11
  • Package: 1206 (3216 Metric)
  • Datasheet: -
  • Stock: 388
  • Description: Fuse Chip Slow Blow Acting 12A 32V SMD Solder Pad 1206 Epoxy Glass Blister T/R(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 1206 (3216 Metric)
Terminal Shape WRAPAROUND
Housing Material Glass
Operating Temperature -55°C~90°C
Packaging Strip
Series UST 1206
Size / Dimension 0.126Lx0.063W x 0.024 H 3.20mmx1.60mmx0.60mm
Part Status Active
Moisture Sensitivity Level (MSL) Vendor Undefined
ECCN Code EAR99
Resistance 4.3mOhm
Terminal Finish NICKEL/GOLD
HTS Code 8536.10.00.40
Voltage - Rated DC 63V
Packing Method BLISTER TAPE
Depth 1.6mm
Current Rating 12A
Reference Standard CSA; UL
Voltage - Rated AC 32V
Approval Agency cURus
Body Length or Diameter 3.2mm
Physical Dimension 3.2mm x 1.6mm x 0.6mm
Response Time Slow Blow
Fuse Type Board Mount (Cartridge Style Excluded)
Breaking Capacity @ Rated Voltage 100A
Melting I2t 33
DC Cold Resistance 0.0039Ohm
Circuit Protection Type ELECTRIC FUSE
Joule Integral-Nom 33 J
Pre-arcing Time-Min 10ms
Body Height 0.6mm
RoHS Status ROHS3 Compliant
See Relate Datesheet

Write a review

Note: HTML is not translated!
    Bad           Good