banner_page

341600F00000G

Heat Sink Passive BGA/PGA/QFP Thin Adhesive Copper


  • Manufacturer: Aavid, Thermal Division of Boyd Corporation
  • Nocochips NO: 4-341600F00000G
  • Package: BGA
  • Datasheet: -
  • Stock: 114
  • Description: Heat Sink Passive BGA/PGA/QFP Thin Adhesive Copper (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Plating Tin
Mount Adhesive
Package / Case BGA
Material Copper
Published 2009
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Color Black
Height 330μm
Length 50.8mm
Width 12.7mm
RoHS Status RoHS Compliant
See Relate Datesheet

Write a review

Note: HTML is not translated!
    Bad           Good