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342000F00000G

Heat Sink Passive BGA/PGA/QFP Thin Adhesive Copper


  • Manufacturer: Aavid, Thermal Division of Boyd Corporation
  • Nocochips NO: 4-342000F00000G
  • Package: BGA
  • Datasheet: PDF
  • Stock: 442
  • Description: Heat Sink Passive BGA/PGA/QFP Thin Adhesive Copper (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Plating Tin
Mount Adhesive
Package / Case BGA
Material Copper
Body Material Copper
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Passive
Color Black
Depth 25.4mm
Height 330μm
Length 101.6mm
Width 25.4mm
RoHS Status RoHS Compliant
See Relate Datesheet

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