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371824B00032G

Heat Sink Passive BGA Pin Array Adhesive Black Anodized


  • Manufacturer: Aavid, Thermal Division of Boyd Corporation
  • Nocochips NO: 4-371824B00032G
  • Package: BGA
  • Datasheet: PDF
  • Stock: 359
  • Description: Heat Sink Passive BGA Pin Array Adhesive Black Anodized (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mount Surface Mount
Package / Case BGA
Material Aluminum
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
Packaging Bulk
Published 2002
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Top Mount
Color Black
Depth 35mm
Attachment Method Thermal Tape, Adhesive (Included)
Height Off Base (Height of Fin) 0.275 7.00mm
Thermal Resistance @ Forced Air Flow 9.70°C/W @ 200 LFM
Thermal Resistance @ Natural 31.90°C/W
Power Dissipation @ Temperature Rise 1.5W @ 50°C
Height 7mm
Length 1.378 35.00mm
Width 1.378 35.00mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status RoHS Compliant
Lead Free Lead Free
See Relate Datesheet

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