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374124B00035G

AAVID THERMALLOY 374124B00035G Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 23.4 C/W, 18 mm, 23 mm, 23 mm


  • Manufacturer: Aavid, Thermal Division of Boyd Corporation
  • Nocochips NO: 4-374124B00035G
  • Package: BGA
  • Datasheet: PDF
  • Stock: 656
  • Description: AAVID THERMALLOY 374124B00035G Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 23.4 C/W, 18 mm, 23 mm, 23 mm (Kg)

Details

Tags

Parameters
Published 2002
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Top Mount
Color Black
Depth 23mm
Attachment Method Thermal Tape, Adhesive (Included)
Height Off Base (Height of Fin) 0.709 18.00mm
Thermal Resistance @ Forced Air Flow 7.40°C/W @ 200 LFM
Thermal Resistance @ Natural 23.40°C/W
Power Dissipation @ Temperature Rise 2.0W @ 50°C
Height 18mm
Length 0.906 23.01mm
Width 0.906 23.01mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status RoHS Compliant
Lead Free Lead Free
Factory Lead Time 1 Week
Mount Adhesive
Package / Case BGA
Number of Pins 71
Material Aluminum
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
Packaging Bulk
See Relate Datesheet

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