Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Solder |
Package / Case | BGA |
Material | Aluminum |
Shape | Square, Pin Fins |
Package Cooled | BGA, FPGA |
Material Finish | Black Anodized |
Published | 2002 |
Series | 37432 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | Not Applicable |
Type | Board Level |
Color | Silver |
Depth | 27mm |
Attachment Method | Solder Anchor |
Height Off Base (Height of Fin) | 0.394 10.00mm |
Thermal Resistance @ Forced Air Flow | 6.00°C/W @ 500 LFM |
Thermal Resistance @ Natural | 30.60°C/W |
Power Dissipation @ Temperature Rise | 1.5W @ 50°C |
Height | 10mm |
Length | 1.063 27.00mm |
Width | 1.063 27.00mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |