banner_page

375024B00032G

Heat Sink Passive BGA Pin Array Adhesive Metal Black Anodized


  • Manufacturer: Aavid, Thermal Division of Boyd Corporation
  • Nocochips NO: 4-375024B00032G
  • Package: BGA
  • Datasheet: PDF
  • Stock: 615
  • Description: Heat Sink Passive BGA Pin Array Adhesive Metal Black Anodized (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case BGA
Material Aluminum
Body Material Metal
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
Packaging Bulk
Published 2002
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Top Mount
Color Black
Depth 40mm
Attachment Method Thermal Tape, Adhesive (Included)
Height Off Base (Height of Fin) 0.709 18.00mm
Thermal Resistance @ Forced Air Flow 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural 12.00°C/W
Power Dissipation @ Temperature Rise 2.0W @ 30°C
Height 18mm
Length 1.575 40.00mm
Width 1.575 40.01mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status RoHS Compliant
Lead Free Lead Free
See Relate Datesheet

Write a review

Note: HTML is not translated!
    Bad           Good