3M863XW DISC 5
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Abrasive Material | Silicon Dioxide |
| Published | 2009 |
| Series | 863XW |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Type | Lapping Film |
| Applications | Fiber Optic Connector Polishing |
| Diameter | 5.00 127.00mm |
| RoHS Status | RoHS Compliant |
See Relate Datesheet
