3MIC 3M662XW DLF 3MIL TH 4.25 IN
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Abrasive Material | Diamond |
| Series | 662XW |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Type | Lapping Film |
| Color | Pink |
| Applications | Fiber Optic Connector Polishing |
| Micron Size | 3μ |
| Diameter | 4.25 107.95mm |
| RoHS Status | RoHS Compliant |
See Relate Datesheet
