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4-1571551-5

IC & Component Sockets SOLID FRAME PC 18


  • Manufacturer: TE Connectivity AMP Connectors
  • Nocochips NO: 792-4-1571551-5
  • Package: DIP
  • Datasheet: -
  • Stock: 178
  • Description: IC & Component Sockets SOLID FRAME PC 18 (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Lifecycle Status ACTIVE (Last Updated: 3 days ago)
Contact Material Copper
Contact Plating Tin, Gold
Mount Through Hole
Mounting Type Through Hole
Package / Case DIP
Insulation Material Polyester
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Number of Positions or Pins (Grid) 18 (2 x 9)
Contact Material - Mating Beryllium Copper
Contact Material - Post Nickel
Operating Temperature -55°C~125°C
Packaging Tube
Published 2005
Series 500
Feature Closed Frame
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Pin
Type DIP, 0.3 (7.62mm) Row Spacing
Number of Positions 18
Max Operating Temperature 105°C
Min Operating Temperature -55°C
Color Black
Number of Rows 2
Voltage - Rated 1kV
Contact Finish - Mating Gold
Pitch 2.54mm
Orientation Straight
Depth 10.16mm
Current Rating 3A
Pitch - Mating 0.100 2.54mm
Number of Contacts 18
Contact Finish - Post Gold
Lead Length 3.175mm
Contact Resistance 10mOhm
Insulation Resistance 5GOhm
Row Spacing 7.62 mm
ELV Compliant
Contact Current Rating 3A
Circuit Application Signal
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm
Length 22.86mm
Width 10.16mm
Plating Thickness 635 nm
Contact Finish Thickness - Mating 25.0μin 0.63μm
Contact Finish Thickness - Post 25.0μin 0.63μm
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
See Relate Datesheet

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