Parameters |
Contact Plating |
Copper, Silver, Tin |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Package / Case |
8-SIP |
Packaging |
Tape & Reel (TR) |
Published |
2011 |
Series |
900 |
Size / Dimension |
0.803Lx0.150W 20.40mmx3.81mm |
Tolerance |
±20% |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
8 |
Termination |
SIP |
Temperature Coefficient |
X7R |
Max Operating Temperature |
125°C |
Min Operating Temperature |
-55°C |
Composition |
Ceramic |
Voltage - Rated |
50V |
Capacitance |
10000pF |
Terminal Pitch |
2.54mm |
Depth |
3.81mm |
Base Part Number |
4608M |
Dielectric |
X7R |
Lead Diameter |
508 μm |
Circuit Type |
Isolated |
Number of Capacitors |
4 |
Height Seated (Max) |
0.200 5.08mm |
Length |
20.4mm |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
4608M-902-103LF Overview
It reaches a maximum height of 0.200 5.08mm when seated.It operates on a size/dimension of 0.803Lx0.150W 20.40mmx3.81mm.There is no voltage rating on the chip.The coefficient of temperature is X7R.A 8-SIP case is used for packaging the product.2.54mm is the terminal pitch of this part.
4608M-902-103LF Features
the maximal height is 0.200 5.08mm
with the size / dimension of 0.803Lx0.150W 20.40mmx3.81mm
a voltage rating of 50V volts
A temperature coefficient of X7R
a 2.54mm terminal pitch
4608M-902-103LF Applications
There are a lot of Bourns Inc. 4608M-902-103LF applications of capacitor networks.
- Professional electronics
- High density consumer electronics