Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Gold |
Mount | Through Hole |
Mounting Type | Through Hole |
Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
Number of Positions or Pins (Grid) | 48 (2 x 24) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Beryllium Copper |
Packaging | Bulk |
Published | 2005 |
Series | 57 |
Feature | Closed Frame |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
Type | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing |
Number of Positions | 48 |
Contact Finish - Mating | Gold |
Current Rating (Amps) | 1A |
Current Rating | 1A |
Pitch - Mating | 0.100 2.54mm |
Contact Finish - Post | Gold |
Lead Length | 2.794mm |
Termination Post Length | 0.110 2.78mm |
Pitch - Post | 0.100 2.54mm |
Contact Finish Thickness - Mating | 10.0μin 0.25μm |
Contact Finish Thickness - Post | 10.0μin 0.25μm |
Material Flammability Rating | UL94 V-0 |
RoHS Status | ROHS3 Compliant |
Flammability Rating | UL94 V-0 |