Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Copper, Silver, Tin |
Mount | Surface Mount |
Number of Pins | 253 |
Published | 2015 |
JESD-609 Code | e1 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 |
Number of Terminations | 253 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Number of Functions | 1 |
Supply Voltage | 1.2V |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Pin Count | 253 |
Interface IC Type | INTERFACE CIRCUIT |
Length | 13.5mm |
Width | 8mm |
Thickness | 1.4mm |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |