Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 2 days ago) |
Contact Material | Phosphor Bronze |
Contact Plating | Gold |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Contact Shape | Square |
Insulation Material | Polyphthalamide (PPA) |
Housing Material | Thermoplastic |
PCB Mounting Orientation | Vertical |
PCB Mount Retention | With |
Operating Temperature | -65°C~105°C |
Packaging | Tube |
Published | 2006 |
Series | AMPMODU System 50 |
Feature | Board Lock |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
Connector Type | Receptacle |
Number of Positions | 10 |
Max Operating Temperature | 105°C |
Min Operating Temperature | -65°C |
Color | Black |
Number of Rows | 2 |
Voltage - Rated | 30VAC |
Fastening Type | Push-Pull |
Contact Finish - Mating | Gold |
Contact Type | Female Socket |
Pitch | 1.27mm |
Orientation | Vertical |
Depth | 5.02mm |
Insulation Height | 0.370 9.40mm |
Style | Board to Board |
Number of Positions Loaded | All |
Pitch - Mating | 0.050 1.27mm |
Insulation Color | Black |
Approval Agency | CSA |
Row Spacing - Mating | 0.100 (2.54mm) |
Number of Contacts | 10 |
Contact Finish - Post | Tin |
Housing Color | Black |
Operating Supply Voltage | 30V |
Insulation Resistance | 5GOhm |
ELV | Compliant |
Max Voltage Rating (AC) | 30V |
Plating | Gold |
Stackable | No |
Height | 9.398mm |
Contact Finish Thickness - Mating | 30.0μin 0.76μm |
Contact Finish Thickness - Post | 150.0μin 3.81μm |
Stack Height (Mating) | 11.94mm 13.08mm |
PCB Thickness | 1.57mm |
Material Flammability Rating | UL94 V-0 |
Radiation Hardening | No |
RoHS Status | RoHS Compliant |
Flammability Rating | UL94 V-0 |