Parameters |
Factory Lead Time |
1 Week |
Contact Material |
Brass |
Contact Plating |
Copper, Gold |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Material - Insulation |
Polyester, Glass Filled |
Operating Temperature |
-65°C~105°C |
Packaging |
Bulk |
Published |
2002 |
JESD-609 Code |
e4 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Termination |
Solder |
ECCN Code |
EAR99 |
Connector Type |
CARD EDGE CONNECTOR |
Number of Positions |
20 |
Color |
Green |
Number of Rows |
2 |
Gender |
Female |
Additional Feature |
VIBRATION RESISTANT |
HTS Code |
8536.69.40.40 |
Subcategory |
Headers and Edge Type Connectors |
MIL Conformance |
YES |
DIN Conformance |
NO |
IEC Conformance |
NO |
Contact Type |
Bifurcated Semi Bellows |
Option |
GENERAL PURPOSE |
Pitch |
0.156 3.96mm |
Total Number of Contacts |
10 |
Orientation |
Straight |
Number of Conductors |
ONE |
Reference Standard |
UL, CSA |
Contact Finish |
Gold |
Number Of PCB Rows |
1 |
PCB Contact Pattern |
RECTANGULAR |
Body Breadth |
0.34 inch |
Body Depth |
0.458 inch |
Rated Current (Signal) |
5A |
Contact Resistance |
6mOhm |
Card Type |
Non Specified - Dual Edge |
Read Out |
Single |
Insulation Resistance |
5000000000Ohm |
Number of Positions/Bay/Row |
10 |
Flange Feature |
Flush Mount, Top Opening, Unthreaded, 0.128 (3.25mm) Dia |
Body/Shell Style |
RECEPTACLE |
Max Current Rating |
5A |
Dielectric Withstanding Voltage |
1800VAC V |
Insertion Force-Max |
4.448 N |
Contact Finish Thickness |
10.0μin 0.25μm |
Card Thickness |
0.054 ~ 0.071 1.37mm ~ 1.80mm |
Length - Termination |
0.156 inch |
RoHS Status |
RoHS Compliant |
50-10B-10 Overview
Materials were packaged according to Bulk's specs.The mounting type Through Hole should be used.The device is connected by using the connector socket CARD EDGE CONNECTOR.There are additionally features of this chip: VIBRATION RESISTANT
50-10B-10 Features
50-10B-10 Applications
There are a lot of Cinch Connectivity Solutions 50-10B-10 Edgeboard Connectors applications.
- In-building wireless telephony
- Automotive
- Data Acquisition Systems
- Medical Instrumentation and medical imaging
- Instrumentation and test equipment
- CMOS Image sensors for mobile applications
- High Speed Data Acquisition for PCs
- Wireless local loop
- Communication Systems
- Communications