Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Through Hole |
Housing Material | POLYETHYLENE POLYESTER |
Number of Positions or Pins (Grid) | 8 (2 x 4) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Brass |
Operating Temperature | -55°C~125°C |
Packaging | Tube |
Published | 2005 |
Series | 500 |
JESD-609 Code | e4 |
Feature | Closed Frame |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
ECCN Code | EAR99 |
Type | DIP, 0.3 (7.62mm) Row Spacing |
Additional Feature | STANDARD: UL 94V-0 |
HTS Code | 8536.69.40.40 |
Contact Finish - Mating | Gold |
Terminal Pitch | 2.54mm |
Pitch - Mating | 0.100 2.54mm |
Body Length or Diameter | 0.4 inch |
Number of Contacts | 8 |
PCB Contact Pattern | RECTANGULAR |
Body Breadth | 0.4 inch |
Body Depth | 0.18 inch |
Contact Style | RND PIN-SKT |
Contact Resistance | 10mOhm |
Mating Contact Pitch | 0.1 inch |
PCB Contact Row Spacing | 0.3 mm |
Termination Post Length | 0.125 3.18mm |
Pitch - Post | 0.100 2.54mm |
Contact Finish Thickness - Mating | 5.00μin 0.127μm |
Contact Finish Thickness - Post | 5.00μin 0.127μm |
RoHS Status | RoHS Compliant |