508-AG10D-ESL
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Through Hole |
| Housing Material | POLYETHYLENE POLYESTER |
| Number of Positions or Pins (Grid) | 8 (2 x 4) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass |
| Operating Temperature | -55°C~125°C |
| Packaging | Tube |
| Published | 2005 |
| Series | 500 |
| JESD-609 Code | e4 |
| Feature | Closed Frame |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Type | DIP, 0.3 (7.62mm) Row Spacing |
| Additional Feature | STANDARD: UL 94V-0 |
| HTS Code | 8536.69.40.40 |
| Contact Finish - Mating | Gold |
| Terminal Pitch | 2.54mm |
| Pitch - Mating | 0.100 2.54mm |
| Body Length or Diameter | 0.4 inch |
| Number of Contacts | 8 |
| PCB Contact Pattern | RECTANGULAR |
| Body Breadth | 0.4 inch |
| Body Depth | 0.18 inch |
| Contact Style | RND PIN-SKT |
| Contact Resistance | 10mOhm |
| Mating Contact Pitch | 0.1 inch |
| PCB Contact Row Spacing | 0.3 mm |
| Termination Post Length | 0.125 3.18mm |
| Pitch - Post | 0.100 2.54mm |
| Contact Finish Thickness - Mating | 5.00μin 0.127μm |
| Contact Finish Thickness - Post | 5.00μin 0.127μm |
| RoHS Status | RoHS Compliant |
See Relate Datesheet
