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508-AG10D-ESL

CONN IC DIP SOCKET 8POS GOLD


  • Manufacturer: TE Connectivity AMP Connectors
  • Nocochips NO: 792-508-AG10D-ESL
  • Package: -
  • Datasheet: PDF
  • Stock: 222
  • Description: CONN IC DIP SOCKET 8POS GOLD (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mounting Type Through Hole
Housing Material POLYETHYLENE POLYESTER
Number of Positions or Pins (Grid) 8 (2 x 4)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Operating Temperature -55°C~125°C
Packaging Tube
Published 2005
Series 500
JESD-609 Code e4
Feature Closed Frame
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.3 (7.62mm) Row Spacing
Additional Feature STANDARD: UL 94V-0
HTS Code 8536.69.40.40
Contact Finish - Mating Gold
Terminal Pitch 2.54mm
Pitch - Mating 0.100 2.54mm
Body Length or Diameter 0.4 inch
Number of Contacts 8
PCB Contact Pattern RECTANGULAR
Body Breadth 0.4 inch
Body Depth 0.18 inch
Contact Style RND PIN-SKT
Contact Resistance 10mOhm
Mating Contact Pitch 0.1 inch
PCB Contact Row Spacing 0.3 mm
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm
Contact Finish Thickness - Mating 5.00μin 0.127μm
Contact Finish Thickness - Post 5.00μin 0.127μm
RoHS Status RoHS Compliant
See Relate Datesheet

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