Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Material | Copper |
Mount | Through Hole |
Mounting Type | Through Hole |
Insulation Material | Polychlorinated |
Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Number of Positions or Pins (Grid) | 225 (18 x 18) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Brass |
Operating Temperature | -55°C~125°C |
Packaging | Bulk |
Published | 2012 |
Series | 510 |
Feature | Open Frame |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
Type | PGA |
Voltage - Rated DC | 150V |
Contact Finish - Mating | Gold |
Orientation | Straight |
Depth | 45.72mm |
Current Rating | 1A |
Pitch - Mating | 0.100 2.54mm |
Voltage - Rated AC | 100V |
Number of Contacts | 225 |
Contact Finish - Post | Tin |
Lead Length | 3.175mm |
Contact Resistance | 10mOhm |
Insulation Resistance | 10GOhm |
Termination Post Length | 0.125 3.18mm |
Pitch - Post | 0.100 2.54mm |
Length | 45.72mm |
Contact Finish Thickness - Mating | 29.5μin 0.75μm |
Material Flammability Rating | UL94 V-0 |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Flammability Rating | UL94 V-0 |