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514-83-257-20-111117

Conn BGA Socket SKT 257 POS 2.54mm Solder ST SMD T/R


  • Manufacturer: Preci-Dip
  • Nocochips NO: 620-514-83-257-20-111117
  • Package: BGA
  • Datasheet: PDF
  • Stock: 746
  • Description: Conn BGA Socket SKT 257 POS 2.54mm Solder ST SMD T/R (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Material Copper
Mount Surface Mount
Mounting Type Surface Mount
Package / Case BGA
Insulation Material Polychlorinated
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Number of Positions or Pins (Grid) 257 (20 x 20)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2012
Series 514
JESD-609 Code e3
Feature Open Frame
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type PGA
Additional Feature STANDARD: UL 94V-0
HTS Code 8536.69.40.40
Voltage - Rated DC 150V
Contact Finish - Mating Gold
Orientation Straight
Depth 50.8mm
Current Rating 1A
Pitch - Mating 0.100 2.54mm
Voltage - Rated AC 100V
Number of Contacts 257
Contact Finish - Post Tin
Lead Length 1.397mm
Contact Resistance 10mOhm
Insulation Resistance 10GOhm
Termination Post Length 0.055 1.40mm
Pitch - Post 0.100 2.54mm
Length 50.8mm
Contact Finish Thickness - Mating 29.5μin 0.75μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Flammability Rating UL94 V-0
See Relate Datesheet

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