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514-83-560M33-001148

CONN SOCKET BGA 560POS GOLD


  • Manufacturer: Preci-Dip
  • Nocochips NO: 620-514-83-560M33-001148
  • Package: -
  • Datasheet: PDF
  • Stock: 169
  • Description: CONN SOCKET BGA 560POS GOLD (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mounting Type Surface Mount
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Number of Positions or Pins (Grid) 560 (33 x 33)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2012
Series 514
Feature Open Frame
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type BGA
Contact Finish - Mating Gold
Current Rating (Amps) 1A
Pitch - Mating 0.100 2.54mm
Contact Finish - Post Tin
Contact Resistance 10mOhm
Termination Post Length 0.055 1.40mm
Pitch - Post 0.100 2.54mm
Contact Finish Thickness - Mating 29.5μin 0.75μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
See Relate Datesheet

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