5145427-5
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Phosphor Bronze |
| Contact Plating | Tin |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Polyphenylene |
| Material - Insulation | Polycyclohexylenedimethylene Terephthalate (PCT) |
| Packaging | Bulk |
| Published | 2009 |
| Feature | Bi-Level - High Density, Board Lock |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Connector Type | CARD EDGE CONNECTOR |
| Number of Positions | 240 |
| Color | Brown |
| Number of Rows | 2 |
| Gender | Female |
| MIL Conformance | NO |
| DIN Conformance | NO |
| IEC Conformance | NO |
| Filter Feature | NO |
| Mixed Contacts | NO |
| Option | GENERAL PURPOSE |
| Pitch | 0.100 2.54mm |
| Total Number of Contacts | 240 |
| Orientation | Straight |
| Contact Finish | Gold |
| Lead Length | -2.79mm |
| Card Type | Non Specified - Dual Edge, Bi-Level |
| Read Out | Dual |
| ELV | Compliant |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Card Thickness | 0.054 ~ 0.070 1.37mm ~ 1.78mm |
| Radiation Hardening | No |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
5145427-5 Overview
We packaged the material in accordance with Bulk's specifications.Mounting type Through Hole is recommended.Connecting the device to the connector socket CARD EDGE CONNECTOR is the method used by the device.There are Bi-Level - High Density, Board Lock features on this device.
5145427-5 Features
5145427-5 Applications
There are a lot of TE Connectivity AMP Connectors 5145427-5 Edgeboard Connectors applications.
- Music recording
- Medical Instrumentation and medical imaging
- Imaging Systems
- 3-phase power control
- Digital beam-forming systems for ultrasound
- GSM, EDGE, PHS, UMTS, WCDMA, CDMA2000,
- Multicarrier, multimode digital receivers
- Multiplexed Data Acquisition Systems
- Wireless and wired broadband communications
- In-building wireless telephony
