531134-5
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | ACTIVE (Last Updated: 1 week ago) |
| Contact Material | Copper |
| Contact Plating | Gold |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Contact Shape | Circular |
| Insulation Material | Polyphenylene Sulfide (PPS) |
| Housing Material | Polyphenylene |
| PCB Mounting Orientation | Vertical |
| PCB Mount Retention | Without |
| Packaging | Bulk |
| Published | 2008 |
| Series | Military, MIL-DTL-55302, Box |
| Feature | Mating Guide |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Termination | Solder |
| Connector Type | Receptacle |
| Number of Positions | 165 |
| Color | Brown |
| Number of Rows | 3 |
| Fastening Type | Push-Pull |
| Contact Finish - Mating | Gold |
| Contact Type | Female Socket |
| Pitch | 2.54mm |
| Orientation | Vertical |
| Insulation Height | 0.450 11.43mm |
| Style | Board to Board |
| Number of Positions Loaded | All |
| Pitch - Mating | 0.100 2.54mm |
| Insulation Color | Brown |
| Row Spacing - Mating | 0.100 (2.54mm) |
| Contact Length - Post | 0.195 4.95mm |
| Number of Contacts | 165 |
| Contact Finish - Post | Tin-Lead |
| Housing Color | Brown |
| Lead Length | 4.953mm |
| ELV | Compliant |
| Plating | Gold |
| Sealable | No |
| Mating Alignment | With |
| Stackable | No |
| Height | 11.43mm |
| Length | 158.75mm |
| Contact Finish Thickness - Mating | 50.0μin 1.27μm |
| Contact Finish Thickness - Post | 100.0μin 2.54μm |
| Length - Tail | 4.953mm |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Lead Free |
See Relate Datesheet
