Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 4 days ago) |
Contact Material | Copper |
Mount | Through Hole |
Mounting Type | Through Hole |
Contact Shape | Square |
Insulation Material | Thermoplastic |
Underplate Material | Nickel |
Operating Temperature | -65°C~125°C |
Packaging | Tube |
Published | 2011 |
Series | Box II |
JESD-609 Code | e0 |
Feature | Mating Guide |
Part Status | Active |
Moisture Sensitivity Level (MSL) | Not Applicable |
Termination | Solder |
ECCN Code | EAR99 |
Connector Type | Receptacle |
Number of Positions | 174 |
Number of Rows | 3 |
Additional Feature | AMP-HDI |
Fastening Type | Push-Pull |
Contact Finish - Mating | Gold |
MIL Conformance | NO |
DIN Conformance | NO |
IEC Conformance | NO |
Filter Feature | NO |
Contact Type | Female Socket |
Mixed Contacts | NO |
Option | GENERAL PURPOSE |
Orientation | Vertical |
Terminal Pitch | 2.54mm |
Insulation Height | 0.400 10.16mm |
Style | Board to Board |
Number of Positions Loaded | All |
Pitch - Mating | 0.100 2.54mm |
Insulation Color | Natural |
Row Spacing - Mating | 0.100 (2.54mm) |
Contact Length - Post | 0.180 4.57mm |
Contact Finish - Post | Tin-Lead |
Housing Color | Brown |
Lead Length | 4.572mm |
ELV | Non-Compliant |
Contact Current Rating | 3A |
Mating Alignment | Without |
Stackable | No |
Height | 10.16mm |
Plating Thickness | 600 nm |
Contact Finish Thickness - Mating | 30.0μin 0.76μm |
Length - Tail | 4.57mm |
PCB Thickness | 3.175mm |
Stack Height | 15.24mm |
RoHS Status | Non-RoHS Compliant |
Lead Free | Contains Lead |