Parameters | |
---|---|
Contact Shape | Square |
Insulation Material | Thermoplastic |
PCB Mounting Orientation | Vertical |
Operating Temperature | -65°C~125°C |
Packaging | Tube |
Published | 1999 |
Series | Micro-Strip |
JESD-609 Code | e0 |
Feature | Board Guide, Ground Bus (Plane) |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
Connector Type | Receptacle |
Number of Positions | 120 |
Number of Rows | 2 |
Voltage - Rated | 30VAC |
Additional Feature | STAGGERED CONFIGURATION |
Fastening Type | Push-Pull |
Contact Finish - Mating | Gold |
MIL Conformance | NO |
DIN Conformance | NO |
IEC Conformance | NO |
Filter Feature | NO |
Contact Type | Female Socket |
Mixed Contacts | NO |
Option | GENERAL PURPOSE |
Orientation | Straight |
Depth | 7.24mm |
Insulation Height | 0.320 8.13mm |
Style | Board to Board |
Number of Positions Loaded | All |
Pitch - Mating | 0.050 1.27mm |
Insulation Color | Natural |
Row Spacing - Mating | 0.100 (2.54mm) |
Contact Length - Post | 0.095 2.41mm |
Contact Finish - Post | Tin-Lead |
Mating Information | MULTIPLE MATING PARTS AVAILABLE |
ELV | Non-Compliant |
Preloaded | Yes |
Stackable | No |
Height | 8.12mm |
Length | 79.76mm |
Contact Finish Thickness - Mating | 30.0μin 0.76μm |
Contact Finish Thickness - Post | 100.0μin 2.54μm |
Length - Tail | 2.41mm |
Stack Height (Mating) | 10.92mm 17.78mm 18.75mm |
Stack Height | 18.7452mm |
RoHS Status | Non-RoHS Compliant |
Factory Lead Time | 1 Week |
Contact Material | Phosphor Bronze |
Mount | Through Hole |
Mounting Type | Through Hole |