5530843-4
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | ACTIVE (Last Updated: 2 days ago) |
| Contact Material | Phosphor Bronze |
| Contact Plating | Gold, Tin |
| Mounting Type | Through Hole |
| Housing Material | Plastic |
| Material - Insulation | Polyester, Glass Filled |
| Operating Temperature | -55°C~ 85°C |
| Packaging | Bulk |
| Published | 2004 |
| Series | Standard Edge II |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Connector Type | CARD EDGE CONNECTOR |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Voltage - Rated | 400V |
| HTS Code | 8536.69.40.40 |
| MIL Conformance | NO |
| DIN Conformance | NO |
| IEC Conformance | NO |
| Filter Feature | NO |
| Mixed Contacts | NO |
| Option | GENERAL PURPOSE |
| Pitch | 0.100 2.54mm |
| Total Number of Contacts | 22 |
| Orientation | Vertical |
| Reach Compliance Code | unknown |
| Contact Finish | Gold |
| Operating Supply Voltage | 400V |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Max Current Rating | 3A |
| Number of Power Positions | 44 |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Plating Thickness | 760 nm |
| Card Thickness | 0.054 ~ 0.070 1.37mm ~ 1.78mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
5530843-4 Overview
The material was packaged according to Bulk's specs.It is recommended to mount the device using mounting type Through Hole.Connecting the device uses the connector socket CARD EDGE CONNECTOR.It is indicated by Standard Edge II that the device is a series device.
5530843-4 Features
Standard Edge II series
5530843-4 Applications
There are a lot of TE Connectivity AMP Connectors 5530843-4 Edgeboard Connectors applications.
- In-building wireless telephony
- Micro and pico cell systems, software radios
- Medical Imaging
- Multicarrier, multimode digital receivers
- Medical Instrumentation and medical imaging
- RADAR processing, digital oscilloscopes
- Instrumentation and test equipment
- High Speed Data Acquisition
- Microcontrollers.
- Broadband data applications
