558-10-500M30-001101
| Parameters | |
|---|---|
| Contact Resistance | 10mOhm |
| Termination Post Length | 0.111 2.83mm |
| Pitch - Post | 0.050 1.27mm |
| Contact Finish Thickness - Mating | 10.0μin 0.25μm |
| Contact Finish Thickness - Post | 10.0μin 0.25μm |
| Material Flammability Rating | UL94 V-0 |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Mounting Type | Through Hole |
| Housing Material | FR4 Epoxy Glass |
| Number of Positions or Pins (Grid) | 500 (30 x 30) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass |
| Operating Temperature | -55°C~125°C |
| Packaging | Bulk |
| Published | 2012 |
| Series | 558 |
| Feature | Closed Frame |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Type | PGA |
| Contact Finish - Mating | Gold |
| Current Rating (Amps) | 1A |
| Pitch - Mating | 0.050 1.27mm |
See Relate Datesheet
