5650181-2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | ACTIVE (Last Updated: 1 week ago) |
| Contact Material | Phosphor Bronze |
| Contact Plating | Tin, Gold |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Material - Insulation | Thermoplastic |
| Underplate Material | Nickel |
| Packaging | Bulk |
| Published | 2005 |
| Series | Standard Edge .050 |
| Feature | Board Guide |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder, Staggered |
| Connector Type | Connector, Receptacle, Socket |
| Number of Positions | 80 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Color | Brown |
| Number of Rows | 2 |
| Gender | Female |
| Pitch | 0.050 1.27mm |
| Orientation | Vertical |
| Current Rating | 1A |
| Contact Finish | Gold |
| Lead Length | 3.56mm |
| Operating Supply Voltage | 203V |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| ELV | Compliant |
| Contact Current Rating | 1A |
| Circuit Application | Signal |
| Height | 13.97mm |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Plating Thickness | 760 nm |
| Card Thickness | 0.062 1.57mm |
| RoHS Status | RoHS Compliant |
5650181-2 Overview
A package was prepared according to Bulk's specifications.There is a recommendation to mount using type Through Hole.The device is connected using the connector socket Connector, Receptacle, Socket.Board Guide features are on this device.It's the Standard Edge .050 that tells you which series it is.An operating temperature of [0°C] ensures stable operation.It needs to work at a minimum of -55°C degrees Celsius.
5650181-2 Features
Standard Edge .050 series
5650181-2 Applications
There are a lot of TE Connectivity AMP Connectors 5650181-2 Edgeboard Connectors applications.
- TD-SCDMA, WiMAX
- Digital beam-forming systems for ultrasound
- Instrumentation and test equipment
- Data Acquisition Systems
- Music recording
- Multicarrier, multimode digital receivers
- Telecommunications
- Displaying
- High Speed Data Acquisition
- Medical Imaging
