573100D00000G
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Package / Case | TO-252 |
| Material | Aluminum |
| Shape | Rectangular, Fins |
| Package Cooled | TO-252 (DPak) |
| Material Finish | Tin |
| Packaging | Box |
| Published | 2007 |
| Series | 5731 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Type | Top Mount |
| Depth | 8mm |
| Attachment Method | SMD Pad |
| Height Off Base (Height of Fin) | 0.400 10.16mm |
| Thermal Resistance @ Forced Air Flow | 12.50°C/W @ 600 LFM |
| Thermal Resistance @ Natural | 15.00°C/W |
| Power Dissipation @ Temperature Rise | 0.8W @ 30°C |
| Height | 10.16mm |
| Length | 0.315 8.00mm |
| Width | 0.900 22.86mm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
See Relate Datesheet
