573400D00010G
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Tin |
| Mount | PCB, Surface Mount |
| Package / Case | TO-268 |
| Material | Copper |
| Shape | Rectangular, Fins |
| Package Cooled | TO-268 (D3Pak) |
| Material Finish | Tin |
| Packaging | Tape & Reel (TR) |
| Published | 2007 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Type | Top Mount |
| Color | Grey |
| Depth | 12.7mm |
| Attachment Method | SMD Pad |
| Height Off Base (Height of Fin) | 0.401 10.20mm |
| Thermal Resistance @ Forced Air Flow | 4.00°C/W @ 600 LFM |
| Thermal Resistance @ Natural | 14.00°C/W |
| Power Dissipation @ Temperature Rise | 1.0W @ 20°C |
| Height | 10.2mm |
| Length | 0.500 12.70mm |
| Width | 1.220 30.99mm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
See Relate Datesheet
