5AGXFB1H4F35I3G
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 1152-BBGA, FCBGA Exposed Pad |
| Supplier Device Package | 1152-FBGA (35x35) |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Series | Arria V GX |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 1.12V~1.18V |
| Number of I/O | 544 |
| Number of Logic Elements/Cells | 300000 |
| Total RAM Bits | 17358848 |
| Number of LABs/CLBs | 14151 |
| RoHS Status | RoHS Compliant |
5AGXFB1H4F35I3G Overview
A 1152-BBGA, FCBGA Exposed Pad package contains it, and it is available for download. 544 I/Os are available for transferring data more efficiently. There are 300000 logic elements/cells to form a fundamental building block. Surface Mount-connectors can be used to attach this FPGA module to the development board. Powered by a 1.12V~1.18V supply voltage, fpga chips is able to operate at high speeds. The FPGA belongs to the Arria V GX series of FPGAs, and it is one type of FPGA. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga electronics is worth mentioning that this device provides 17358848 bfpga electronics s of RAM. Fpga electronics contains 14151 LABs/CLBs in an array. Device package 1152-FBGA (35x35) is provided by its supplier.
5AGXFB1H4F35I3G Features
544 I/Os
Up to 17358848 RAM bits
5AGXFB1H4F35I3G Applications
There are a lot of Intel 5AGXFB1H4F35I3G FPGAs applications.
- High Performance Computing
- Solar Energy
- ADAS
- Filtering and communication encoding
- Random logic
- Integrating multiple SPLDs
- Wireless Communications
- Telecommunication
- ASIC prototyping
- Data center search engines
