5ASXFB5H4F40I3NES
| Parameters | |
|---|---|
| Package / Case | 1517-BBGA, FCBGA |
| Supplier Device Package | 1517-FBGA, FC (40x40) |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Series | Arria V SX |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Base Part Number | 5ASXFB5 |
| Number of I/O | MCU - 208, FPGA - 540 |
| Speed | 1.05GHz |
| RAM Size | 64KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | FPGA - 462K Logic Elements |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).There is a 1517-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Arria V SX is the series number of this system on chip SoC.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.A key point to note is that this SoC security combines FPGA - 462K Logic Elements.Housed in the state-of-art Tray package.In total, this SoC part has MCU - 208, FPGA - 540 I/Os.5ASXFB5 can help you find system on chips with similar specs and purposes.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
64KB RAM.
Built on MCU, FPGA.
There are a lot of Intel
5ASXFB5H4F40I3NES System On Chip (SoC) applications.
- Samsung galaxy gear
- Central alarm system
- Mobile computing
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- Smart appliances
- High-end PLC
- Mouse
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- Special Issue Editors
- Measurement testers
