Parameters |
Factory Lead Time |
1 Week |
Package / Case |
896-BGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2018 |
Series |
Cyclone® V ST |
JESD-609 Code |
e1 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
896 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.1V |
Terminal Pitch |
1mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Base Part Number |
5CSTFD6 |
JESD-30 Code |
S-PBGA-B896 |
Number of Outputs |
288 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.13V |
Power Supplies |
1.11.2/3.32.5V |
Supply Voltage-Min (Vsup) |
1.07V |
Number of I/O |
MCU - 181, FPGA - 288 |
Speed |
800MHz |
RAM Size |
64KB |
Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Peripherals |
DMA, POR, WDT |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Number of Inputs |
288 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 110K Logic Elements |
Number of Logic Cells |
110000 |
Height Seated (Max) |
2mm |
Length |
31mm |
Width |
31mm |
RoHS Status |
RoHS Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).There is a 896-BGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides users with reliable performance.The SoC design uses MCU, FPGA architecture for its internal architecture.The system on a chip is part of the series Cyclone? V ST.The average operating temps for this SoC meaning should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of FPGA - 110K Logic Elements.A state-of-the-art Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of MCU - 181, FPGA - 288 inputs and outputs.It is advised to utilize a 1.1V power supply.In the SoCs wireless, high voltages above 1.13V are considered dangerous and should not be used.Power supply should be at least 1.07V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.In total, there are 896 terminations, which makes system on a chip possible.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.You can have 288 user outputs for this SoC chip.As far as power supplies are concerned, system on chip requires 1.11.2/3.32.5V.A SoC chip with 288 inputs is available to the user.Logic system on chips features 110000 logic cells.Searching 5CSTFD6 will yield system on chips with similar specs and purposes.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
64KB RAM.
Built on MCU, FPGA.
There are a lot of Intel
5CSTFD6D5F31I7N System On Chip (SoC) applications.
- POS Terminals
- Samsung galaxy gear
- Smart appliances
- POS Terminals
- Wireless sensor networks
- PC peripherals
- sequence controllers
- Communication interfaces ( I2C, SPI )
- Automotive gateway
- Remote control