5CSXFC6D6F31C8NES
| Parameters | |
|---|---|
| Package / Case | 896-BGA |
| Supplier Device Package | 896-FBGA (31x31) |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Series | Cyclone® V SX |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Base Part Number | 5CSXFC6 |
| Number of I/O | MCU - 181, FPGA - 288 |
| Speed | 600MHz |
| RAM Size | 64KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA, POR, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | FPGA - 110K Logic Elements |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.Manufacturer assigns package 896-BGA to this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.A MCU, FPGA technique is used for the SoC design's internal architecture.It is part of the Cyclone? V SX series of system on a chips.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.This SoC security combines FPGA - 110K Logic Elements and that is something to note.It comes in a state-of-the-art Tray package.This SoC part contains a total of MCU - 181, FPGA - 288 I/Os in total.Searching 5CSXFC6 will yield system on chips with similar specs and purposes.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
64KB RAM.
Built on MCU, FPGA.
There are a lot of Intel
5CSXFC6D6F31C8NES System On Chip (SoC) applications.
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