Parameters | |
---|---|
Contact Material | Copper |
Contact Plating | Gold, Tin |
Mount | Through Hole |
Housing Material | Thermoplastic |
Package Accepted | 8-DIP, 4 Lead (Half Size) |
Published | 2000 |
Series | 500 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Through Hole |
ECCN Code | EAR99 |
Connector Type | Pin |
Number of Positions | 8 |
Max Operating Temperature | 125°C |
Min Operating Temperature | -55°C |
Number of Rows | 2 |
Pitch | 2.54mm |
Orientation | Straight |
Current Rating | 3A |
Number of Contacts | 4 |
Lead Length | 2.79mm |
Contact Style | Screw |
Contact Resistance | 10mOhm |
Insulation Resistance | 5GOhm |
Row Spacing | 7.62 mm |
ELV | Compliant |
Accessory Type | Socket, Full Size |
Contact Current Rating | 3A |
Circuit Application | Signal |
Device Socket Type | IC SOCKET |
Length | 17.78mm |
Plating Thickness | 635 nm |
Radiation Hardening | No |
REACH SVHC | Unknown |
RoHS Status | RoHS Compliant |
Flammability Rating | UL94 V-0 |
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 2 days ago) |