Parameters | |
---|---|
Color | Black |
Attachment Method | Clip, Thermal Material |
Height Off Base (Height of Fin) | 0.500 12.70mm |
Thermal Resistance @ Forced Air Flow | 2.50°C/W @ 250 LFM |
Natural Thermal Resistance | 2.5 °C/W |
Height | 12.7mm |
Length | 2.895 73.53mm |
Width | 2.000 50.80mm |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Factory Lead Time | 1 Week |
Mount | Clip |
Package / Case | BGA |
Material | Aluminum |
Shape | Rectangular, Pin Fins |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Material Finish | Black Anodized |
Packaging | Bulk |
Published | 2008 |
Series | 609 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | Not Applicable |
Type | Top Mount |