Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Material | BERYLLIUM COPPER |
Housing Material | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER |
Mounting Style | STRAIGHT |
Packaging | Bulk |
JESD-609 Code | e4 |
Pbfree Code | yes |
Part Status | Active |
ECCN Code | EAR99 |
Additional Feature | PGA SOCKET |
HTS Code | 8536.90.40.00 |
Contact Finish - Mating | GOLD (30) OVER NICKEL (50) |
Terminal Pitch | 2.54mm |
Current Rating | 1A |
Body Length or Diameter | 1.1 inch |
Number of Contacts | 68 |
PCB Contact Pattern | RECTANGULAR |
Operating Temperature (Max) | 125°C |
Body Breadth | 1.1 inch |
Operating Temperature (Min) | -55°C |
Body Depth | 0.031 inch |
Contact Style | RND PIN-SKT |
Insulation Resistance | 10000000000Ohm |
Mating Contact Pitch | 0.1 inch |
Termination Type | SOLDER |
Dielectric Withstanding Voltage | 1000VAC V |
PCB Contact Row Spacing | 0.1 mm |
Contact Finish Termination | Gold (Au) - with Nickel (Ni) barrier |
Device Socket Type | IC SOCKET |
Device Type Used On | PGA68 |
Contact Configuration | 11X11 |
RoHS Status | ROHS3 Compliant |