Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Material | Copper |
Contact Plating | Gold |
Insulation Material | Polychlorinated |
Housing Material | PLASTIC |
Published | 2012 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
ECCN Code | EAR99 |
Max Operating Temperature | 125°C |
Min Operating Temperature | -55°C |
Number of Rows | 2 |
Additional Feature | LOW PROFILE |
HTS Code | 8536.90.40.00 |
Voltage - Rated DC | 150V |
Pitch | 2.54mm |
Orientation | Straight |
Depth | 25.3mm |
Current Rating | 3A |
Number of Contacts | 64 |
Contact Resistance | 10mOhm |
Insulation Resistance | 10GOhm |
Row Spacing | 22.86 mm |
Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier |
Device Socket Type | IC SOCKET |
Device Type Used On | DIP64 |
Length | 81.2mm |
RoHS Status | ROHS3 Compliant |