Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Adhesive |
Package / Case | BGA |
Material | Aluminum |
Shape | Square, Pin Fins |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Material Finish | Black Anodized |
Packaging | Bulk |
Published | 2001 |
Series | 628 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | Not Applicable |
Type | Top Mount |
Color | Black |
Attachment Method | Thermal Tape, Adhesive (Not Included) |
Height Off Base (Height of Fin) | 0.650 16.51mm |
Thermal Resistance @ Forced Air Flow | 2.00°C/W @ 400 LFM |
Natural Thermal Resistance | 2 °C/W |
Profile | PIN FIN ARRAY |
Power Dissipation @ Temperature Rise | 3.0W @ 20°C |
Fin Orientation | OMNIDIRECT |
Height | 16.5mm |
Length | 1.750 44.45mm |
Width | 1.700 43.18mm |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |