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628-65AB

HEATSINK CPU 43MM SQ BLK H=.65"


  • Manufacturer: Wakefield-Vette
  • Nocochips NO: 869-628-65AB
  • Package: BGA
  • Datasheet: -
  • Stock: 503
  • Description: HEATSINK CPU 43MM SQ BLK H=.65" (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mount Adhesive
Package / Case BGA
Material Aluminum
Shape Square, Pin Fins
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Material Finish Black Anodized
Packaging Bulk
Published 2001
Series 628
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Top Mount
Color Black
Attachment Method Thermal Tape, Adhesive (Not Included)
Height Off Base (Height of Fin) 0.650 16.51mm
Thermal Resistance @ Forced Air Flow 2.00°C/W @ 400 LFM
Natural Thermal Resistance 2 °C/W
Profile PIN FIN ARRAY
Power Dissipation @ Temperature Rise 3.0W @ 20°C
Fin Orientation OMNIDIRECT
Height 16.5mm
Length 1.750 44.45mm
Width 1.700 43.18mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
See Relate Datesheet

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